Programme

Wednesday 15 April 2026

09:00 Walk-in, Registration & Innovation Market

Coffee, informal networking & Innovation market with TNO technologies & start-up companies.

10:00 Opening

Welcome and Opening with Lisa Burk and Rogier Verberk
  • Pasfoto Rogier Verberk
    Rogier Verberk
    Director Semicon & Quantum
    (TNO)
  • Pasfoto Lisa Burke
    Lisa Burke
    Event moderator

10:20 Building bridges to reach Moore

Keynote of Junichi Tanaka, Senior Chief Strategist at Hitachi Hightech Company
  • Pasfoto Junichi Tanaka
    Junichi Tanaka
    Senior Chief Strategist
    (Hitachi Hightech Company)

10:45 Invisix Measuring Systems: Short wavelength metrology for the 3D device era

Keynote of Christina Porter, Co-Founder and CEO of Invisix
  • Pasfoto Christina Porter
    Christina Porter
    Co-founder and CEO
    (Invisix)

11:10 TNO Technology Pitches

Topics: Artificial intelligence and Acoustic metrology
  • Pasfoto Rob Snel
    Rob Snel
    Senior system engineer
    (TNO)
  • Pasfoto Benoit Quesson
    Benoit Quesson
    senior scientist
    (TNO)

11:20 Building bridges with Photonics

Talk & Chat with Johan Feenstra, CEO SMART Photonics
  • Pasfoto Johan Feenstra
    Johan Feenstra
    CEO
    (SMART Photonics)

11:45 Pitch FononTech

Pitch of Jelle de Jong, FononTech
  • Pasfoto Jelle de Jong
    Jelle de Jong
    Senior Vice President Marketing & Sales
    (FononTech)

11:50 Wrap-up & Closure

  • Pasfoto Rogier Verberk
    Rogier Verberk
    Director Semicon & Quantum
    (TNO)
  • Pasfoto Lisa Burke
    Lisa Burke
    Event moderator

12:00 Lunch, networking and innovation market

With booths of TNO researchers, start-up companies and partners

13:29 Afternoon programme with parallel sessions

While completing your registration, you have the option to sign up for one of these sessions.

13:30 Sessions round 1

13:30 Artificial intelligence for industry

Artificial intelligence seems everywhere and promises to be capable of tackling every task we throw at it. But state of the art AI still requires large data sets thereby hindering both cost effectiveness and agility. TNO aims to lower these thresholds to practical applicability. We set the goal to reduce the minimum series size for applications in data analysis and design. Standing on the shoulders of Big Tech we combine knowledge of physics and AI to create sovereign models for specific applications. We take you on a tour to show you our work and hear your insights.
 

  • Pasfoto Rob Snel
    Rob Snel
    Senior system engineer
    (TNO)
13:30 Europe’s semiconductor business case
Insights into a strategic demand-driven study for a resilient and competitive Europe.

This session presents first strategic insights from the forthcoming European Semiconductor Demand Study, a joint European public–private initiative by industry and government, led by ZVEI, FME and the ministries of Economic Affairs of The Netherlands and Germany. The study links future semiconductor demand from key European end markets to a comparative assessment of costs, investment conditions and location factors versus other global regions for semiconductor industry. It provides an evidence based foundation for the debate on Chips Act 2.0, illustrating where Europe is competitive, where gaps remain, and why coordinated action by policymakers and industry is required to strengthen resilient and competitive semiconductor value chains across Europe. Join this session to gain first insights into the study results and to discuss how Europe can reinforce its semiconductor value chains, and which public and private actions are needed to turn ambition into investment.

  • Pasfoto Niels Back
    Niels Back
    Manager High Tech Industry
    (FME)
13:30 MicroFluidic Chip Cooling for Telecom, Automotive and AI Datacenters

High density high performance microelectronics are critical in the hyperconnected sustainable world of tomorrow. We will make a deep dive into TNO’s MicroFluidic 2 Phase cooling technology platform. How does it work, how did we apply it in telecom and automotive use cases? What is the effect of current AI compute demands on the thermal design powers of server CPUs & GPUs used within the hyperscale datacenter infrastructure? Get an insight in MicroFluidic IN-Heat spreader and IN-Chip/ IN-Silicon cooling demonstrators that enable efficient AI compute and opportunities to re-use the high quality waste heat energy in local district heating circuits or industrial processes.       

  • Pasfoto Patrique Boerboom
    Patrique Boerboom
    Business Development Manager Semicon & Quantum
    (TNO)

14:45 Sessions round 2

14:45 FononTech: Impulse Printing™ for Advanced Packaging

Discover the applications of Impulse Printing: wirebond replacement, vertical pillar formation, wrap-around and conformal antenna. Impulse Printing is a fast, non-contact printing technology for high-volume manufacturing. 

  • Pasfoto Fabien Bruning
    Fabien Bruning
    Co-founder
    (FononTech)
14:45 How can CITC support the EU semiconductor industry with advanced chip assembly, test, and design?

Within its fully equipped back-end assembly lab in Nijmegen, CITC is assembling and functionally testing power and RF devices for 3rd parties and research purposes (incl. silver sintering die attach up to integration of diamond heat spreaders and liquid cooling). To reduce packaging cost and environmental impact, CITC is developing a 100% additive panel level power discrete concept using TNO’s screen-printing and plating expertise in Eindhoven. To enable future 6G communication, CITC is also working on new high-frequency wafer and panel level packaging designs (incl. high aspect ratio through polymer via interconnects).

  • Pasfoto Ruud de Wit
    Ruud de Wit
    Business Development Manager
    (TNO CITC)
  • Pasfoto Tindara Verduci
    Tindara Verduci
    Senior scientist
    (TNO CITC)
  • Pasfoto Edsger Smits
    Edsger Smits
    Senior Researcher
    (TNO CITC)

15:30 Drinks and networking